Datasheets
B30921D7025Y918 by:

Wireless LAN Circuit, CMOS, LGA-168

Part Details for B30921D7025Y918 by TDK Corporation

Overview of B30921D7025Y918 by TDK Corporation

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for B30921D7025Y918

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B30921D7025Y918 Part Data Attributes

B30921D7025Y918 TDK Corporation
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B30921D7025Y918 TDK Corporation Wireless LAN Circuit, CMOS, LGA-168
Part Life Cycle Code Obsolete
Ihs Manufacturer TDK CORP
Package Description LGA-168
Reach Compliance Code unknown
HTS Code 8542.39.00.01
JESD-30 Code R-XBGA-B168
Length 10.5 mm
Number of Functions 1
Number of Terminals 168
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Package Body Material UNSPECIFIED
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Seated Height-Max 1.4 mm
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Telecom IC Type WIRELESS LAN CIRCUIT
Temperature Grade OTHER
Terminal Form BALL
Terminal Position BOTTOM
Width 9.3 mm

Alternate Parts for B30921D7025Y918

This table gives cross-reference parts and alternative options found for B30921D7025Y918. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of B30921D7025Y918, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
B30921D7022Y918 DATACOM, WIRELESS LAN CIRCUIT TDK Epcos B30921D7025Y918 vs B30921D7022Y918
B30921D7025Y918 DATACOM, WIRELESS LAN CIRCUIT TDK Epcos B30921D7025Y918 vs B30921D7025Y918
B30911D7021Y918 DATACOM, WIRELESS LAN CIRCUIT TDK Epcos B30921D7025Y918 vs B30911D7021Y918

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