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Overview of ATMEGA649P-AUR by Atmel Corporation
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- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for ATMEGA649P-AUR by Atmel Corporation
Part Data Attributes for ATMEGA649P-AUR by Atmel Corporation
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
ATMEL CORP
|
Part Package Code
|
QFP
|
Package Description
|
TQFP, TQFP64,.63SQ,32
|
Pin Count
|
64
|
Reach Compliance Code
|
compliant
|
HTS Code
|
8542.31.00.01
|
Core Architecture
|
AVR
|
Device Core
|
AVR
|
Clock Speed
|
16
|
Ram
|
4
|
Flash Memory
|
64
|
Can
|
0
|
Adc Channels
|
8
|
Adc Resolution
|
10
|
Samacsys Manufacturer
|
Microchip
|
Has ADC
|
YES
|
Additional Feature
|
ALSO OPERATES AT 2.7 V MINIMUM SUPPLY AT 8 MHZ AND 1.8 V MINIMUM SUPPLY AT 4 MHZ
|
Address Bus Width
|
|
Bit Size
|
8
|
CPU Family
|
AVR RISC
|
Clock Frequency-Max
|
16 MHz
|
DAC Channels
|
NO
|
DMA Channels
|
NO
|
External Data Bus Width
|
|
JESD-30 Code
|
S-PQFP-G64
|
Length
|
14 mm
|
Moisture Sensitivity Level
|
3
|
Number of I/O Lines
|
54
|
Number of Terminals
|
64
|
On Chip Program ROM Width
|
8
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
PWM Channels
|
YES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TQFP
|
Package Equivalence Code
|
TQFP64,.63SQ,32
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK, THIN PROFILE
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
4096
|
ROM (words)
|
65536
|
ROM Programmability
|
FLASH
|
Seated Height-Max
|
1.2 mm
|
Speed
|
16 MHz
|
Supply Current-Max
|
6.2 mA
|
Supply Voltage-Max
|
5.5 V
|
Supply Voltage-Min
|
4.5 V
|
Supply Voltage-Nom
|
5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
QUAD
|
Width
|
14 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER, RISC
|
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