Part Details for AT25XE011-XMHN-T by Dialog Semiconductor GmbH
Overview of AT25XE011-XMHN-T by Dialog Semiconductor GmbH
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
AT25XE011-XMHN-T | Renesas Electronics Corporation | 1Mbit, 1.65V to 3.6V Range SPI Serial Flash Memory with Dual Read Support and Low Read Current | |
AT25XE011-XMHN-B | Renesas Electronics Corporation | 1Mbit, 1.65V to 3.6V Range SPI Serial Flash Memory with Dual Read Support and Low Read Current | |
AT25XE011-SSHN-B | Renesas Electronics Corporation | 1Mbit, 1.65V to 3.6V Range SPI Serial Flash Memory with Dual Read Support and Low Read Current |
Part Details for AT25XE011-XMHN-T
AT25XE011-XMHN-T CAD Models
AT25XE011-XMHN-T Part Data Attributes
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AT25XE011-XMHN-T
Dialog Semiconductor GmbH
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Datasheet
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AT25XE011-XMHN-T
Dialog Semiconductor GmbH
Flash, 1MX1, PDSO8,
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | DIALOG SEMICONDUCTOR GMBH | |
Reach Compliance Code | compliant | |
Clock Frequency-Max (fCLK) | 104 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e4 | |
Length | 4.4 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Programming Voltage | 1.8 V | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.000015 A | |
Supply Current-Max | 0.013 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Type | NOR TYPE | |
Width | 3 mm | |
Write Protection | HARDWARE |