Part Details for AT25256B-MAPDGV-E by Atmel Corporation
Overview of AT25256B-MAPDGV-E by Atmel Corporation
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- Part Data Attributes: (Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for AT25256B-MAPDGV-E
AT25256B-MAPDGV-E CAD Models
AT25256B-MAPDGV-E Part Data Attributes
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AT25256B-MAPDGV-E
Atmel Corporation
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Datasheet
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AT25256B-MAPDGV-E
Atmel Corporation
EEPROM, 32KX8, Serial, CMOS, PDSO8, UDFN-8
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ATMEL CORP | |
Package Description | HVSON, | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Date Of Intro | 2016-09-14 | |
JESD-30 Code | R-PDSO-N8 | |
Length | 3 mm | |
Memory Density | 262144 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Parallel/Serial | SERIAL | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 0.6 mm | |
Serial Bus Type | SPI | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Width | 2 mm |