Part Details for AT24C256W-10SI by Atmel Corporation
Overview of AT24C256W-10SI by Atmel Corporation
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| TPS826810SIPT | Texas Instruments | 1.6-A HIGH-EFFICIENCY STEP-DOWN CONVERTER Module in MicroSiP? 9-uSiP -40 to 85 | |
| TPS826810SIPR | Texas Instruments | 1.6-A HIGH-EFFICIENCY STEP-DOWN CONVERTER Module in MicroSiP? 9-uSiP -40 to 85 | |
| OPA2310SIRUGR | Texas Instruments | Dual-channel, 5.5-V, 3-MHz high-output-current (150-mA) fast-shutdown (1-µs) operational amplifier 10-X2QFN -40 to 125 |
Part Details for AT24C256W-10SI
AT24C256W-10SI CAD Models
AT24C256W-10SI Part Data Attributes
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AT24C256W-10SI
Atmel Corporation
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AT24C256W-10SI
Atmel Corporation
EEPROM, 32KX8, Serial, CMOS, PDSO8, 0.200 INCH, EIAJ, PLASTIC, SOIC-8
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | SOIC | |
| Package Description | 0.200 INCH, EIAJ, PLASTIC, SOIC-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | HARDWARE & SOFTWARE DATA PROTECTION; DATA RETENTION 40 YEARS | |
| Clock Frequency-Max (fCLK) | 1 MHz | |
| Data Retention Time-Min | 40 | |
| Endurance | 100000 Write/Erase Cycles | |
| I2C Control Byte | 10100DDR | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e0 | |
| Length | 5.31 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.03 mm | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.000006 A | |
| Supply Current-Max | 0.003 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 5.27 mm | |
| Write Cycle Time-Max (tWC) | 10 ms | |
| Write Protection | HARDWARE |