Part Details for AS9C25128M2036L-166BC by Alliance Semiconductor Corporation
Overview of AS9C25128M2036L-166BC by Alliance Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 70V7319S166BCI | Renesas Electronics Corporation | 256K x 18 Synchronous Bank-Switchable Dual-Port SRAM | |
| 70V7339S166BCI8 | Renesas Electronics Corporation | 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM | |
| 70P3519S166BCGI | Renesas Electronics Corporation | 256K X 36 DP |
Part Details for AS9C25128M2036L-166BC
AS9C25128M2036L-166BC CAD Models
AS9C25128M2036L-166BC Part Data Attributes
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AS9C25128M2036L-166BC
Alliance Semiconductor Corporation
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Datasheet
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AS9C25128M2036L-166BC
Alliance Semiconductor Corporation
Dual-Port SRAM, 128KX36, 10ns, CMOS, PBGA256, BGA-256
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ALLIANCE SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 10 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 256 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm |
Alternate Parts for AS9C25128M2036L-166BC
This table gives cross-reference parts and alternative options found for AS9C25128M2036L-166BC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS9C25128M2036L-166BC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT70V7599S166BC8 | Dual-Port SRAM, 128KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Integrated Device Technology Inc | AS9C25128M2036L-166BC vs IDT70V7599S166BC8 |
| IDT70V7599S133BCGI8 | Dual-Port SRAM, 128KX36, 15ns, PBGA256, BGA-256 | Integrated Device Technology Inc | AS9C25128M2036L-166BC vs IDT70V7599S133BCGI8 |
| AS9C25128M2036L-166BC | Dual-Port SRAM, 128KX36, 10ns, CMOS, PBGA256, BGA-256 | Integrated Silicon Solution Inc | AS9C25128M2036L-166BC vs AS9C25128M2036L-166BC |
| 70T659S8BC | CABGA-256, Tray | Integrated Device Technology Inc | AS9C25128M2036L-166BC vs 70T659S8BC |
| CYD04S36V18-200BBC | Dual-Port SRAM, 128KX36, 9ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 | Cypress Semiconductor | AS9C25128M2036L-166BC vs CYD04S36V18-200BBC |
| IDT70T659S8BC8 | Dual-Port SRAM, 128KX36, 8ns, CMOS, PBGA256, BGA-256 | Integrated Device Technology Inc | AS9C25128M2036L-166BC vs IDT70T659S8BC8 |
| AS9C25128M2036L-166BI | Dual-Port SRAM, 128KX36, 10ns, CMOS, PBGA256, BGA-256 | Integrated Silicon Solution Inc | AS9C25128M2036L-166BC vs AS9C25128M2036L-166BI |
| 70T3599S200BC | CABGA-256, Tray | Integrated Device Technology Inc | AS9C25128M2036L-166BC vs 70T3599S200BC |
| CYD04S36V18-200BBI | Dual-Port SRAM, 128KX36, 9ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 | Cypress Semiconductor | AS9C25128M2036L-166BC vs CYD04S36V18-200BBI |
| 70T3599S200BCG | CABGA-256, Tray | Integrated Device Technology Inc | AS9C25128M2036L-166BC vs 70T3599S200BCG |