Datasheets
AS8S128K32Q-25/IT by: Micross Components

SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68

Part Details for AS8S128K32Q-25/IT by Micross Components

Overview of AS8S128K32Q-25/IT by Micross Components

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for AS8S128K32Q-25/IT

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AS8S128K32Q-25/IT Part Data Attributes

AS8S128K32Q-25/IT Micross Components
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AS8S128K32Q-25/IT Micross Components SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer MICROSS COMPONENTS
Part Package Code QFP
Package Description QFP, QFP68,.99SQ,50
Pin Count 68
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 25 ns
Additional Feature ALSO CONFIGURABLE AS 512K X 8
Alternate Memory Width 16
I/O Type COMMON
JESD-30 Code S-CQFP-G68
JESD-609 Code e0
Length 22.352 mm
Memory Density 4194304 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 68
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QFP
Package Equivalence Code QFP68,.99SQ,50
Package Shape SQUARE
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.006 A
Standby Voltage-Min 2 V
Supply Current-Max 0.56 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 22.352 mm

Alternate Parts for AS8S128K32Q-25/IT

This table gives cross-reference parts and alternative options found for AS8S128K32Q-25/IT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS8S128K32Q-25/IT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-9559508HZA Cache SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 Cobham Power Products AS8S128K32Q-25/IT vs 5962-9559508HZA
5962-9559515HMA SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components AS8S128K32Q-25/IT vs 5962-9559515HMA
5962-9559515HMX SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components AS8S128K32Q-25/IT vs 5962-9559515HMX
5962-9559515HMA SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 Mercury Systems Inc AS8S128K32Q-25/IT vs 5962-9559515HMA
AS8S128K32QT-25/XT SRAM Module, 128KX32, 25ns, CMOS, CQFP68, 0.140 INCH HEIGHT, CERAMIC, QFP-68 Micross Components AS8S128K32Q-25/IT vs AS8S128K32QT-25/XT
ACT-S128K32N-025F2Q Cache SRAM Module, 128KX32, 25ns, CMOS, CQMA68, 0.880 X 0.880 INCH, DUAL CAVITY, CERAMIC, QFP-68 Cobham PLC AS8S128K32Q-25/IT vs ACT-S128K32N-025F2Q
5962-9559515HMC SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components AS8S128K32Q-25/IT vs 5962-9559515HMC
5962-9559514HNC SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Mercury Systems Inc AS8S128K32Q-25/IT vs 5962-9559514HNC
5962-9559514HNC SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components AS8S128K32Q-25/IT vs 5962-9559514HNC
AS8S128K32QT-25/IT SRAM Module, 128KX32, 25ns, CMOS, CQFP68, 0.140 INCH HEIGHT, CERAMIC, QFP-68 Micross Components AS8S128K32Q-25/IT vs AS8S128K32QT-25/IT
Part Number Description Manufacturer Compare
5962-8866208TX Standard SRAM, 32KX8, 15ns, CMOS, CDFP28, CERAMIC, FP-28 Micross Components AS8S128K32Q-25/IT vs 5962-8866208TX
5962-9318708H4X SRAM Module, 128KX32, 25ns, CMOS, CHIP66, HERMETIC SEALED, CERAMIC, HIP-66 White Microelectronics AS8S128K32Q-25/IT vs 5962-9318708H4X
5962-8685917UX Standard SRAM, 16KX4, 35ns, CMOS, 0.560 X 0.358 INCH, 0.075 HEIGHT, LCC-28 Cypress Semiconductor AS8S128K32Q-25/IT vs 5962-8685917UX
5962-9461108HMC Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 0.880 X 0.880 INCH, 0.200 INCH HEIGHT, DUAL CAVITY, CERAMIC, QFP-68 Cobham Power Products AS8S128K32Q-25/IT vs 5962-9461108HMC
5962-8552508XA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, CERDIP-28 Pyramid Semiconductor Corporation AS8S128K32Q-25/IT vs 5962-8552508XA
5962-9318701H4A SRAM Module, 128KX32, 120ns, CMOS, HIP-66 Microsemi Corporation AS8S128K32Q-25/IT vs 5962-9318701H4A
5962-3829454MZX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components AS8S128K32Q-25/IT vs 5962-3829454MZX
FT6264L-12FMB Standard SRAM, 8KX8, 12ns, CMOS, CDFP28, CERAMIC, FLAT PACKAGE, 28 PIN Force Technologies Ltd AS8S128K32Q-25/IT vs FT6264L-12FMB
P4C164-35CI Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation AS8S128K32Q-25/IT vs P4C164-35CI
DPS128X32V3-85B SRAM Module, 512KX8, 85ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc AS8S128K32Q-25/IT vs DPS128X32V3-85B

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