Part Details for AS27C256-17JM by Micross Components
Overview of AS27C256-17JM by Micross Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for AS27C256-17JM
AS27C256-17JM CAD Models
AS27C256-17JM Part Data Attributes
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AS27C256-17JM
Micross Components
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Datasheet
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AS27C256-17JM
Micross Components
UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROSS COMPONENTS | |
Part Package Code | DIP | |
Package Description | 0.600 INCH, CERAMIC, DIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 170 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CDIP-T28 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 12.5 V | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Seated Height-Max | 5.8928 mm | |
Standby Current-Max | 0.0003 A | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15.24 mm |
Alternate Parts for AS27C256-17JM
This table gives cross-reference parts and alternative options found for AS27C256-17JM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS27C256-17JM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27C256-170/BXA | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AS27C256-17JM vs AM27C256-170/BXA |
TMS27C256-1JE | UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | AS27C256-17JM vs TMS27C256-1JE |
SMJ27C256-17JM | UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Micross Components | AS27C256-17JM vs SMJ27C256-17JM |
AM27256-17DIB | UVPROM, 32KX8, 170ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AS27C256-17JM vs AM27256-17DIB |
AM27C256-170DEB | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AS27C256-17JM vs AM27C256-170DEB |
TMS27C256-1JL | 262 144-Bitprogrammable Read-Only Memory 28-CDIP 0 to 70 | Texas Instruments | AS27C256-17JM vs TMS27C256-1JL |
TMS27C256-17JE | 32KX8 UVPROM, 170ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Texas Instruments | AS27C256-17JM vs TMS27C256-17JE |
TMS27C256-17JL4 | 32KX8 UVPROM, 170ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AS27C256-17JM vs TMS27C256-17JL4 |
AM27C256-170DCB | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AS27C256-17JM vs AM27C256-170DCB |
AM27C256-170DE | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AS27C256-17JM vs AM27C256-170DE |