Part Details for APA300-FGG256PP by Microsemi Corporation
Overview of APA300-FGG256PP by Microsemi Corporation
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for APA300-FGG256PP
APA300-FGG256PP CAD Models
APA300-FGG256PP Part Data Attributes
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APA300-FGG256PP
Microsemi Corporation
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APA300-FGG256PP
Microsemi Corporation
Field Programmable Gate Array, 180MHz, 8192-Cell, CMOS, PBGA256,
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Clock Frequency-Max | 180 MHz | |
JESD-30 Code | S-PBGA-B256 | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 186 | |
Number of Logic Cells | 8192 | |
Number of Outputs | 186 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 |