Part Details for APA300-FG256IX95 by Microsemi FPGA & SoC
Overview of APA300-FG256IX95 by Microsemi FPGA & SoC
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for APA300-FG256IX95
APA300-FG256IX95 CAD Models
APA300-FG256IX95 Part Data Attributes
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APA300-FG256IX95
Microsemi FPGA & SoC
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Datasheet
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APA300-FG256IX95
Microsemi FPGA & SoC
FPGA, 300000 GATES, 180MHz, PBGA256, 1 MM PITCH, FPBGA-256
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI SOC PRODUCTS GROUP | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO OPERATES AT 3 TO 3.6 V SUPPLY | |
| Clock Frequency-Max | 180 MHz | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Number of Equivalent Gates | 300000 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 300000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 230 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD/TIN LEAD SILVER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 17 mm |