Datasheets
AMP2101-1 by: AMD

Standard SRAM, 256X4, 500ns, NMOS, PDIP22, PLASTIC, DIP-22

Part Details for AMP2101-1 by AMD

Overview of AMP2101-1 by AMD

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Applications Education and Research Environmental Monitoring Industrial Automation Agriculture Technology Medical Imaging Electronic Manufacturing

Part Details for AMP2101-1

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AMP2101-1 Part Data Attributes

AMP2101-1 AMD
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AMP2101-1 AMD Standard SRAM, 256X4, 500ns, NMOS, PDIP22, PLASTIC, DIP-22
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP,
Pin Count 22
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 500 ns
JESD-30 Code R-PDIP-T22
Length 27.94 mm
Memory Density 1024 bit
Memory IC Type STANDARD SRAM
Memory Width 4
Number of Functions 1
Number of Ports 1
Number of Terminals 22
Number of Words 256 words
Number of Words Code 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256X4
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for AMP2101-1

This table gives cross-reference parts and alternative options found for AMP2101-1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AMP2101-1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M38510/23112BWC Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff AMP2101-1 vs M38510/23112BWC
AM91L01APC Standard SRAM, 256X4, 500ns, MOS, PDIP22, PLASTIC, DIP-22 AMD AMP2101-1 vs AM91L01APC
M38510/23112BWA Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff AMP2101-1 vs M38510/23112BWA
5962-8859403WA Standard SRAM, 256X4, 25ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Cypress Semiconductor AMP2101-1 vs 5962-8859403WA
MAS5101CB Standard SRAM, 256X4, 130ns, CMOS, CDIP22 Dynex Semiconductor AMP2101-1 vs MAS5101CB
P4C422-12PC Standard SRAM, 256X4, 12ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 Pyramid Semiconductor Corporation AMP2101-1 vs P4C422-12PC
AM93412ADCB Standard SRAM, 256X4, 35ns, TTL, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD AMP2101-1 vs AM93412ADCB
M38510/23112BWX Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 Harris Semiconductor AMP2101-1 vs M38510/23112BWX
93422APCQR Cache SRAM, 256X4, 35ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 Fairchild Semiconductor Corporation AMP2101-1 vs 93422APCQR
C2101A-4 Standard SRAM, 256X4, 400ns, MOS, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD AMP2101-1 vs C2101A-4

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