Part Details for AM29F200BB-75DWC1 by Spansion
Overview of AM29F200BB-75DWC1 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for AM29F200BB-75DWC1
AM29F200BB-75DWC1 CAD Models
AM29F200BB-75DWC1 Part Data Attributes
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AM29F200BB-75DWC1
Spansion
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Datasheet
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AM29F200BB-75DWC1
Spansion
Flash, 128KX16, 70ns, WAFER-42
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | WAFER | |
| Package Description | DIE, DIE OR CHIP | |
| Pin Count | 42 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 70 ns | |
| Additional Feature | BOTTOM BOOT BLOCK | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM | |
| Command User Interface | YES | |
| Data Polling | YES | |
| Endurance | 1000000 Write/Erase Cycles | |
| JESD-30 Code | R-XUUC-N42 | |
| JESD-609 Code | e0 | |
| Memory Density | 2097152 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 1,2,1,3 | |
| Number of Terminals | 42 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX16 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Sector Size | 16K,8K,32K,64K | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Toggle Bit | YES | |
| Type | NOR TYPE |
Alternate Parts for AM29F200BB-75DWC1
This table gives cross-reference parts and alternative options found for AM29F200BB-75DWC1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM29F200BB-75DWC1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.