There are no models available for this part yet.
Overview of AM27S37/BUA by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 4 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Price & Stock for AM27S37/BUA by AMD
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
2156-AM27S37/BUA-ND
|
DigiKey | IC PROM 8KBIT PARALLEL 32CLCC Min Qty: 3 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
157 In Stock |
|
$112.1500 | Buy Now | |
DISTI #
AM27S37/BUA
|
Avnet Americas | 1KX8 OTPROM, CQCC32, CERAMIC, LCC-32 - Bulk (Alt: AM27S37/BUA) RoHS: Not Compliant Min Qty: 4 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Bulk | 157 Partner Stock |
|
RFQ | ||
Rochester Electronics | AM27S37 - OTP ROM, 1KX8 - Dual marked (5962-8670603XA) ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 157 |
|
$96.2500 / $113.2400 | Buy Now |
CAD Models for AM27S37/BUA by AMD
Part Data Attributes for AM27S37/BUA by AMD
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Part Package Code
|
QFJ
|
Package Description
|
QCCN, LCC32,.45X.55
|
Pin Count
|
32
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
|
Factory Lead Time
|
4 Weeks
|
Access Time-Max
|
30 ns
|
JESD-30 Code
|
R-CQCC-N32
|
JESD-609 Code
|
e0
|
Length
|
13.97 mm
|
Memory Density
|
16384 bit
|
Memory IC Type
|
OTP ROM
|
Memory Width
|
4
|
Number of Functions
|
1
|
Number of Terminals
|
32
|
Number of Words
|
1024 words
|
Number of Words Code
|
4000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-55 °C
|
Organization
|
4KX4
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code
|
QCCN
|
Package Equivalence Code
|
LCC32,.45X.55
|
Package Shape
|
RECTANGULAR
|
Package Style
|
CHIP CARRIER
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Screening Level
|
38535Q/M;38534H;883B
|
Seated Height-Max
|
2.54 mm
|
Supply Current-Max
|
0.185 mA
|
Supply Voltage-Max (Vsup)
|
5.25 V
|
Supply Voltage-Min (Vsup)
|
4.75 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
YES
|
Technology
|
BIPOLAR
|
Temperature Grade
|
MILITARY
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
NO LEAD
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
QUAD
|
Width
|
11.43 mm
|
Alternate Parts for AM27S37/BUA
This table gives cross-reference parts and alternative options found for AM27S37/BUA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S37/BUA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
AM27S37ALC | OTP ROM, 1KX8, Bipolar, CQCC32, CERAMIC, LCC-32 | AMD | AM27S37/BUA vs AM27S37ALC |
AM27S37ALCB | OTP ROM, 1KX8, Bipolar, CQCC32, CERAMIC, LCC-32 | AMD | AM27S37/BUA vs AM27S37ALCB |
AM27S37/BUC | OTP ROM, 1KX8, Bipolar, CQCC32, CERAMIC, LCC-32 | AMD | AM27S37/BUA vs AM27S37/BUC |
AM27S37A/BUA | OTP ROM, 1KX8, Bipolar, CQCC32, CERAMIC, LCC-32 | AMD | AM27S37/BUA vs AM27S37A/BUA |