Datasheets
AM27S25SA/B3C by:

OTP ROM, 512X8, 15ns, Bipolar, CQCC28, CERAMIC, LCC-28

Part Details for AM27S25SA/B3C by AMD

Overview of AM27S25SA/B3C by AMD

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Applications Computing and Data Storage

Part Details for AM27S25SA/B3C

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AM27S25SA/B3C Part Data Attributes

AM27S25SA/B3C AMD
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AM27S25SA/B3C AMD OTP ROM, 512X8, 15ns, Bipolar, CQCC28, CERAMIC, LCC-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code QLCC
Package Description QCCN, LCC28,.45SQ
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 25 ns
JESD-30 Code S-CQCC-N28
JESD-609 Code e0
Length 11.43 mm
Memory Density 4096 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 512 words
Number of Words Code 512
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512X8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QCCN
Package Equivalence Code LCC28,.45SQ
Package Shape SQUARE
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 1.905 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 11.43 mm

Alternate Parts for AM27S25SA/B3C

This table gives cross-reference parts and alternative options found for AM27S25SA/B3C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S25SA/B3C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
53RA481AJS883B OTP ROM, 512X8, 30ns, CMOS, CDIP24, Monolithic Memories (RETIRED) AM27S25SA/B3C vs 53RA481AJS883B
5962-88518053A OTP ROM, 512X8, CMOS, CQCC28, CERAMIC, LCC-28 Cypress Semiconductor AM27S25SA/B3C vs 5962-88518053A
AM27S25LCB-S OTP ROM, 512X8, 27ns, Bipolar, CQCC28, CERAMIC, LCC-28 AMD AM27S25SA/B3C vs AM27S25LCB-S
AM27S25APCB OTP ROM, 512X8, 20ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 AMD AM27S25SA/B3C vs AM27S25APCB
5962-8851803LB OTP ROM, 512X8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor AM27S25SA/B3C vs 5962-8851803LB
82S141/BJA IC 512 X 8 OTPROM, 90 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM NXP Semiconductors AM27S25SA/B3C vs 82S141/BJA
TBP28L46NW 512X8 OTPROM, 95ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 Texas Instruments AM27S25SA/B3C vs TBP28L46NW
DM74S474J IC 512 X 8 OTPROM, 65 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM Texas Instruments AM27S25SA/B3C vs DM74S474J
CY7C225A-25DI OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor AM27S25SA/B3C vs CY7C225A-25DI
6341-1JXXXX OTP ROM, 512X8, 70ns, CMOS, CDIP24, Monolithic Memories (RETIRED) AM27S25SA/B3C vs 6341-1JXXXX

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