Part Details for AM27S25SA/B3C by AMD
Overview of AM27S25SA/B3C by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for AM27S25SA/B3C
AM27S25SA/B3C CAD Models
AM27S25SA/B3C Part Data Attributes
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AM27S25SA/B3C
AMD
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Datasheet
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AM27S25SA/B3C
AMD
OTP ROM, 512X8, 15ns, Bipolar, CQCC28, CERAMIC, LCC-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | QLCC | |
Package Description | QCCN, LCC28,.45SQ | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 25 ns | |
JESD-30 Code | S-CQCC-N28 | |
JESD-609 Code | e0 | |
Length | 11.43 mm | |
Memory Density | 4096 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 512 words | |
Number of Words Code | 512 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 512X8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QCCN | |
Package Equivalence Code | LCC28,.45SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Seated Height-Max | 1.905 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.43 mm |
Alternate Parts for AM27S25SA/B3C
This table gives cross-reference parts and alternative options found for AM27S25SA/B3C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S25SA/B3C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
53RA481AJS883B | OTP ROM, 512X8, 30ns, CMOS, CDIP24, | Monolithic Memories (RETIRED) | AM27S25SA/B3C vs 53RA481AJS883B |
5962-88518053A | OTP ROM, 512X8, CMOS, CQCC28, CERAMIC, LCC-28 | Cypress Semiconductor | AM27S25SA/B3C vs 5962-88518053A |
AM27S25LCB-S | OTP ROM, 512X8, 27ns, Bipolar, CQCC28, CERAMIC, LCC-28 | AMD | AM27S25SA/B3C vs AM27S25LCB-S |
AM27S25APCB | OTP ROM, 512X8, 20ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | AM27S25SA/B3C vs AM27S25APCB |
5962-8851803LB | OTP ROM, 512X8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | AM27S25SA/B3C vs 5962-8851803LB |
82S141/BJA | IC 512 X 8 OTPROM, 90 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM | NXP Semiconductors | AM27S25SA/B3C vs 82S141/BJA |
TBP28L46NW | 512X8 OTPROM, 95ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Texas Instruments | AM27S25SA/B3C vs TBP28L46NW |
DM74S474J | IC 512 X 8 OTPROM, 65 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM | Texas Instruments | AM27S25SA/B3C vs DM74S474J |
CY7C225A-25DI | OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | Cypress Semiconductor | AM27S25SA/B3C vs CY7C225A-25DI |
6341-1JXXXX | OTP ROM, 512X8, 70ns, CMOS, CDIP24, | Monolithic Memories (RETIRED) | AM27S25SA/B3C vs 6341-1JXXXX |