Part Details for AM27S25/BLA by Rochester Electronics LLC
Overview of AM27S25/BLA by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27S25DM | Rochester Electronics LLC | OTP ROM |
Part Details for AM27S25/BLA
AM27S25/BLA CAD Models
AM27S25/BLA Part Data Attributes
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AM27S25/BLA
Rochester Electronics LLC
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Datasheet
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AM27S25/BLA
Rochester Electronics LLC
OTP ROM, 512X8, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| JESD-30 Code | R-GDIP-T24 | |
| Length | 31.9405 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 512 words | |
| Number of Words Code | 512 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512X8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for AM27S25/BLA
This table gives cross-reference parts and alternative options found for AM27S25/BLA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S25/BLA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C225-30DMB | OTP ROM, 512X8, 20ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 | Cypress Semiconductor | AM27S25/BLA vs CY7C225-30DMB |
| AM27S25ADCB | OTP ROM, 512X8, 20ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | AMD | AM27S25/BLA vs AM27S25ADCB |
| AM27S25ADC | OTP ROM, 512X8, 20ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | AMD | AM27S25/BLA vs AM27S25ADC |
| AM27S25APCB | OTP ROM, 512X8, 20ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | AM27S25/BLA vs AM27S25APCB |
| AM27S25A/BLA | OTP ROM, 512X8, 25ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | AMD | AM27S25/BLA vs AM27S25A/BLA |