Part Details for AM27LV010B-300LEB by AMD
Overview of AM27LV010B-300LEB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for AM27LV010B-300LEB
AM27LV010B-300LEB CAD Models
AM27LV010B-300LEB Part Data Attributes:
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AM27LV010B-300LEB
AMD
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Datasheet
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AM27LV010B-300LEB
AMD
UVPROM, 128KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | QFJ | |
| Package Description | WQCCN, LCC32,.45X.55 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CQCC-N32 | |
| JESD-609 Code | e0 | |
| Length | 13.97 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WQCCN | |
| Package Equivalence Code | LCC32,.45X.55 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.556 mm | |
| Standby Current-Max | 0.000025 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 11.43 mm |
Alternate Parts for AM27LV010B-300LEB
This table gives cross-reference parts and alternative options found for AM27LV010B-300LEB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27LV010B-300LEB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27H010-55/BXA | UVPROM, 128KX8, 55ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27LV010B-300LEB vs AM27H010-55/BXA |
| AM27LV010B-200EC | OTP ROM, 128KX8, 200ns, CMOS, PDSO32, PLASTIC, TSOP-32 | AMD | AM27LV010B-300LEB vs AM27LV010B-200EC |
| AT27LV010A-90TI | OTP ROM, 128KX8, 90ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, MO-142BD, TSOP-32 | Atmel Corporation | AM27LV010B-300LEB vs AT27LV010A-90TI |
| AM27H010-45V05LCB | UVPROM, 128KX8, 45ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM27LV010B-300LEB vs AM27H010-45V05LCB |
| AM27H010-90PC | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, PLASTIC, DIP-32 | AMD | AM27LV010B-300LEB vs AM27H010-90PC |
| AM27LV010B-200EI | OTP ROM, 128KX8, 200ns, CMOS, PDSO32, PLASTIC, TSOP-32 | AMD | AM27LV010B-300LEB vs AM27LV010B-200EI |
| AM27LV010-300DIB | UVPROM, 128KX8, 300ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27LV010B-300LEB vs AM27LV010-300DIB |
| AM27LV010B-250EC | OTP ROM, 128KX8, 250ns, CMOS, PDSO32, PLASTIC, TSOP-32 | AMD | AM27LV010B-300LEB vs AM27LV010B-250EC |
| AM27LV010-300JC | OTP ROM, 128KX8, 300ns, CMOS, PQCC32, PLASTIC, LCC-32 | AMD | AM27LV010B-300LEB vs AM27LV010-300JC |
| AT27C010L-12TC | OTP ROM, 128KX8, 120ns, CMOS, PDSO32, PLASTIC, MO-142BD, TSOP-32 | Atmel Corporation | AM27LV010B-300LEB vs AT27C010L-12TC |