Part Details for AM27LS06DC by AMD
Overview of AM27LS06DC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Financial Technology (Fintech)
Computing and Data Storage
Automotive
Part Details for AM27LS06DC
AM27LS06DC CAD Models
AM27LS06DC Part Data Attributes:
|
AM27LS06DC
AMD
Buy Now
Datasheet
|
Compare Parts:
AM27LS06DC
AMD
Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP16,.3 | |
Pin Count | 16 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 55 ns | |
JESD-30 Code | R-GDIP-T16 | |
JESD-609 Code | e0 | |
Length | 19.431 mm | |
Memory Density | 64 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 16 | |
Number of Words | 16 words | |
Number of Words Code | 16 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | ||
Organization | 16X4 | |
Output Characteristics | OPEN-COLLECTOR | |
Output Enable | NO | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | TTL | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for AM27LS06DC
This table gives cross-reference parts and alternative options found for AM27LS06DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27LS06DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
AM27S02PCB | Standard SRAM, 16X4, 35ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | AM27LS06DC vs AM27S02PCB |
N7489B | Standard SRAM, 16X4, TTL, PDIP16 | Signetics | AM27LS06DC vs N7489B |
74F219AN | Standard SRAM, 16X4, 10ns, TTL, PDIP16 | YAGEO Corporation | AM27LS06DC vs 74F219AN |
AM3101DC | Standard SRAM, 16X4, 50ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS06DC vs AM3101DC |
S54S189F | 16X4 STANDARD SRAM, 50ns, CDIP16 | Philips Semiconductors | AM27LS06DC vs S54S189F |
MCM10145L | 16X4 STANDARD SRAM, 15ns, CDIP16, 620-09 | Motorola Mobility LLC | AM27LS06DC vs MCM10145L |
AM27S02ADC | Standard SRAM, 16X4, 25ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS06DC vs AM27S02ADC |
AM27S07APCB | Standard SRAM, 16X4, 25ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | AM27LS06DC vs AM27S07APCB |
54F189DM | Standard SRAM, 16X4, 23ns, CMOS, CDIP16, CERAMIC, DIP-16 | Fairchild Semiconductor Corporation | AM27LS06DC vs 54F189DM |
AM27LS07DCB | Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Rochester Electronics LLC | AM27LS06DC vs AM27LS07DCB |