There are no models available for this part yet.
Overview of AM27HB010-90PC by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 8 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 8 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Transportation and Logistics
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
CAD Models for AM27HB010-90PC by AMD
Part Data Attributes for AM27HB010-90PC by AMD
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
|
Part Package Code
|
DIP
|
|
Package Description
|
DIP, DIP32,.6
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Access Time-Max
|
90 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PDIP-T32
|
|
JESD-609 Code
|
e0
|
|
Length
|
42.164 mm
|
|
Memory Density
|
1048576 bit
|
|
Memory IC Type
|
OTP ROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
131072 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
128KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP32,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.715 mm
|
|
Standby Current-Max
|
0.001 A
|
|
Supply Current-Max
|
0.1 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
15.24 mm
|
Alternate Parts for AM27HB010-90PC
This table gives cross-reference parts and alternative options found for AM27HB010-90PC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27HB010-90PC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT27C010-90PA | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Atmel Corporation | AM27HB010-90PC vs AT27C010-90PA |
| AM27C010-90PC | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, PLASTIC, DIP-32 | Spansion | AM27HB010-90PC vs AM27C010-90PC |
| AM27X010-90PI | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, PLASTIC, DIP-32 | AMD | AM27HB010-90PC vs AM27X010-90PI |
| MX27C1001PC-90 | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Macronix International Co Ltd | AM27HB010-90PC vs MX27C1001PC-90 |
| CY27C010-90DMB | OTP ROM, 128KX8, 90ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERDIP-32 | Cypress Semiconductor | AM27HB010-90PC vs CY27C010-90DMB |
| IS27C010-90W | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Integrated Silicon Solution Inc | AM27HB010-90PC vs IS27C010-90W |
| AM27X010-90PCXXXXX | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, PLASTIC, DIP-32 | AMD | AM27HB010-90PC vs AM27X010-90PCXXXXX |
| AM27C010-90PI | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, PLASTIC, DIP-32 | Spansion | AM27HB010-90PC vs AM27C010-90PI |