Part Details for AM27HB010-90DI by AMD
Overview of AM27HB010-90DI by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Transportation and Logistics
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LTC1290DISW#PBF | Analog Devices | 1x Chip 12-B Data Acquisition | |
| LTC1290DISW#TRPBF | Analog Devices | 1x Chip 12-B Data Acquisition | |
| LTC1290DIN#PBF | Analog Devices | 1x Chip 12-B Data Acquisition |
Part Details for AM27HB010-90DI
AM27HB010-90DI CAD Models
AM27HB010-90DI Part Data Attributes
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AM27HB010-90DI
AMD
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Datasheet
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AM27HB010-90DI
AMD
UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 90 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42.1005 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Standby Current-Max | 0.001 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27HB010-90DI
This table gives cross-reference parts and alternative options found for AM27HB010-90DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27HB010-90DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27HB010-90DE | UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27HB010-90DI vs AM27HB010-90DE |
| AM27HB010-90DC | UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27HB010-90DI vs AM27HB010-90DC |
| AM27C010-90DC | UVPROM, 128KX8, 90ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | AM27HB010-90DI vs AM27C010-90DC |
| MX27C1000DC-90 | UVPROM, 128KX8, 90ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Macronix International Co Ltd | AM27HB010-90DI vs MX27C1000DC-90 |
| AM27HB010-90DCB | UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27HB010-90DI vs AM27HB010-90DCB |
| WS27C010L-90D | UVPROM, 128KX8, 90ns, CMOS, CDIP32, | Waferscale Integration Inc | AM27HB010-90DI vs WS27C010L-90D |
| 5962-8961407MXA | UVPROM, 128KX8, 90ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | AM27HB010-90DI vs 5962-8961407MXA |
| FT27C010L-90DI | UVPROM, 128KX8, 90ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIL-32 | Force Technologies Ltd | AM27HB010-90DI vs FT27C010L-90DI |
| WS27C010L-90DMB | UVPROM, 128KX8, 90ns, CMOS, CDIP32, CERDIP-32 | Waferscale Integration Inc | AM27HB010-90DI vs WS27C010L-90DMB |
| AM27C010-90DI | UVPROM, 128KX8, 90ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | AM27HB010-90DI vs AM27C010-90DI |