Part Details for AM27H010-90V05PC by AMD
Overview of AM27H010-90V05PC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27H010-90V05PC
AM27H010-90V05PC CAD Models
AM27H010-90V05PC Part Data Attributes:
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AM27H010-90V05PC
AMD
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Datasheet
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AM27H010-90V05PC
AMD
OTP ROM, 128KX8, 90ns, CMOS, PDIP32, PLASTIC, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 90 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42.164 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Standby Current-Max | 0.025 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27H010-90V05PC
This table gives cross-reference parts and alternative options found for AM27H010-90V05PC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27H010-90V05PC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27H010-55/BXA | UVPROM, 128KX8, 55ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27H010-90V05PC vs AM27H010-55/BXA |
| AM27LV010B-200EC | OTP ROM, 128KX8, 200ns, CMOS, PDSO32, PLASTIC, TSOP-32 | AMD | AM27H010-90V05PC vs AM27LV010B-200EC |
| AT27LV010A-90TI | OTP ROM, 128KX8, 90ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, MO-142BD, TSOP-32 | Atmel Corporation | AM27H010-90V05PC vs AT27LV010A-90TI |
| AM27H010-45V05LCB | UVPROM, 128KX8, 45ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM27H010-90V05PC vs AM27H010-45V05LCB |
| AM27H010-90PC | OTP ROM, 128KX8, 90ns, CMOS, PDIP32, PLASTIC, DIP-32 | AMD | AM27H010-90V05PC vs AM27H010-90PC |
| AM27LV010B-200EI | OTP ROM, 128KX8, 200ns, CMOS, PDSO32, PLASTIC, TSOP-32 | AMD | AM27H010-90V05PC vs AM27LV010B-200EI |
| AM27LV010-300DIB | UVPROM, 128KX8, 300ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27H010-90V05PC vs AM27LV010-300DIB |
| AM27LV010B-250EC | OTP ROM, 128KX8, 250ns, CMOS, PDSO32, PLASTIC, TSOP-32 | AMD | AM27H010-90V05PC vs AM27LV010B-250EC |
| AM27LV010-300JC | OTP ROM, 128KX8, 300ns, CMOS, PQCC32, PLASTIC, LCC-32 | AMD | AM27H010-90V05PC vs AM27LV010-300JC |
| AT27C010L-12TC | OTP ROM, 128KX8, 120ns, CMOS, PDSO32, PLASTIC, MO-142BD, TSOP-32 | Atmel Corporation | AM27H010-90V05PC vs AT27C010L-12TC |