Part Details for AM27C256-300/BUA by Rochester Electronics LLC
Overview of AM27C256-300/BUA by Rochester Electronics LLC
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27C256-300/BUA
AM27C256-300/BUA CAD Models
AM27C256-300/BUA Part Data Attributes:
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AM27C256-300/BUA
Rochester Electronics LLC
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Datasheet
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AM27C256-300/BUA
Rochester Electronics LLC
UVPROM, 32KX8, 300ns, CMOS, CQCC32, LCC-32
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Package Description | QCCN, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| JESD-30 Code | R-CQCC-N32 | |
| Length | 13.97 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 3.556 mm | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 11.43 mm |