Part Details for AM27C256-250LEB by AMD
Overview of AM27C256-250LEB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
| AM27C256-120PC-G | Rochester Electronics | AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM | |
| AM27C256-150DI | Rochester Electronics LLC | Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics. |
Part Details for AM27C256-250LEB
AM27C256-250LEB CAD Models
AM27C256-250LEB Part Data Attributes
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AM27C256-250LEB
AMD
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Datasheet
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AM27C256-250LEB
AMD
UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | QFJ | |
| Package Description | WQCCN, LCC32,.45X.55 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CQCC-N32 | |
| Length | 13.97 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WQCCN | |
| Package Equivalence Code | LCC32,.45X.55 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.556 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 11.43 mm |
Alternate Parts for AM27C256-250LEB
This table gives cross-reference parts and alternative options found for AM27C256-250LEB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-250LEB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS27C256A-25ECAM/MIL | Memory IC | Micross Components | AM27C256-250LEB vs AS27C256A-25ECAM/MIL |
| 5962-8606302YC | UVPROM, 32KX8, 250ns, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | AM27C256-250LEB vs 5962-8606302YC |
| 5962-8606302YX | IC 32K X 8 UVPROM, 250 ns, CQCC32, WINDOWED, CERAMIC, LCC-32, Programmable ROM | National Semiconductor Corporation | AM27C256-250LEB vs 5962-8606302YX |
| 5962-8606302YA | UVPROM, 32KX8, 250ns, CMOS, CQCC32, CERAMIC, LCC-32 | Intel Corporation | AM27C256-250LEB vs 5962-8606302YA |
| 5962-8606302YA | UVPROM, 32KX8, 250ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | AM27C256-250LEB vs 5962-8606302YA |
| AS27C256-25ECAI | UVPROM, 32KX8, 250ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | AM27C256-250LEB vs AS27C256-25ECAI |
| AM27C256-250LCB | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM27C256-250LEB vs AM27C256-250LCB |
| AM27C256-250LIB | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM27C256-250LEB vs AM27C256-250LIB |
| AM27C256-250LE | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AM27C256-250LEB vs AM27C256-250LE |
| 5962-8606302YA | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Atmel Corporation | AM27C256-250LEB vs 5962-8606302YA |