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Overview of AM27C256-155DC by Rochester Electronics LLC
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- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
CAD Models for AM27C256-155DC by Rochester Electronics LLC
Part Data Attributes for AM27C256-155DC by Rochester Electronics LLC
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|
---|---|
Part Life Cycle Code
|
Active
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Ihs Manufacturer
|
ROCHESTER ELECTRONICS LLC
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Package Description
|
DIP,
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.61
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Access Time-Max
|
150 ns
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JESD-30 Code
|
R-GDIP-T28
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Length
|
37.1475 mm
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Memory Density
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262144 bit
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Memory IC Type
|
UVPROM
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Memory Width
|
8
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Number of Functions
|
1
|
Number of Terminals
|
28
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Number of Words
|
32768 words
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Number of Words Code
|
32000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
Organization
|
32KX8
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Package Body Material
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CERAMIC, GLASS-SEALED
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Package Code
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DIP
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
|
PARALLEL
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Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
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Seated Height-Max
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5.588 mm
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Supply Current-Max
|
0.025 mA
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Supply Voltage-Max (Vsup)
|
5.25 V
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Supply Voltage-Min (Vsup)
|
4.75 V
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Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
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Technology
|
CMOS
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Temperature Grade
|
COMMERCIAL
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Terminal Form
|
THROUGH-HOLE
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Terminal Pitch
|
2.54 mm
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Terminal Position
|
DUAL
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Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
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Width
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15.24 mm
|