Part Details for AM27C1024-55DI by Spansion
Overview of AM27C1024-55DI by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27C010-55DI | Rochester Electronics LLC | 27C010 - 1024K (128K x 8) CMOS EPROM | |
| AM27C512-55DI | Rochester Electronics | AM27C512 - 512K (64K x 8) CMOS EPROM |
Part Details for AM27C1024-55DI
AM27C1024-55DI CAD Models
AM27C1024-55DI Part Data Attributes
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AM27C1024-55DI
Spansion
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Datasheet
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AM27C1024-55DI
Spansion
UVPROM, 64KX16, 55ns, CMOS, CDIP40, CERAMIC, DIP-40
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-CDIP-T40 | |
| Length | 52.26 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 40 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64KX16 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C1024-55DI
This table gives cross-reference parts and alternative options found for AM27C1024-55DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C1024-55DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT27HC1024-55DI | UVPROM, 64KX16, 55ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | Atmel Corporation | AM27C1024-55DI vs AT27HC1024-55DI |
| MX27C1024DC-55 | UVPROM, 64KX16, 55ns, CMOS, CDIP40, CERAMIC, DIP-40 | Macronix International Co Ltd | AM27C1024-55DI vs MX27C1024DC-55 |
| M27C1024-55F7X | 64KX16 UVPROM, 55ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | STMicroelectronics | AM27C1024-55DI vs M27C1024-55F7X |
| AM27C1024-55DC | UVPROM, 64KX16, 55ns, CMOS, CDIP40, CERAMIC, DIP-40 | Spansion | AM27C1024-55DI vs AM27C1024-55DC |
| AM27C1024-55DC5B | UVPROM, 64KX16, 55ns, CMOS, CDIP40, CERAMIC, DIP-40 | Spansion | AM27C1024-55DI vs AM27C1024-55DC5B |
| M27C1024-55XF7X | 64KX16 UVPROM, 55ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | STMicroelectronics | AM27C1024-55DI vs M27C1024-55XF7X |