Part Details for AM27C020-200DCB by Spansion
Overview of AM27C020-200DCB by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
AM27C512-200DCB | Rochester Electronics | AM27C512 - 512K (64K x 8) CMOS EPROM |
Part Details for AM27C020-200DCB
AM27C020-200DCB CAD Models
AM27C020-200DCB Part Data Attributes
|
AM27C020-200DCB
Spansion
Buy Now
Datasheet
|
Compare Parts:
AM27C020-200DCB
Spansion
UVPROM, 256KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32
|
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
JESD-30 Code | R-CDIP-T32 | |
Length | 42.1 mm | |
Memory Density | 2097152 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Seated Height-Max | 5.58 mm | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM27C020-200DCB
This table gives cross-reference parts and alternative options found for AM27C020-200DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C020-200DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
TMS27C020-20JL4 | 256KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | Texas Instruments | AM27C020-200DCB vs TMS27C020-20JL4 |
AM27C020-200DCB | UVPROM, 256KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27C020-200DCB vs AM27C020-200DCB |
AM27C020-200DC | UVPROM, 256KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27C020-200DCB vs AM27C020-200DC |
AM27C020-200DI | UVPROM, 256KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27C020-200DCB vs AM27C020-200DI |
TMS27C020-20JE4 | 256KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | Texas Instruments | AM27C020-200DCB vs TMS27C020-20JE4 |
AT27C020-20DI | UVPROM, 256KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | AM27C020-200DCB vs AT27C020-20DI |
AM27C020-200DI | UVPROM, 256KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | AM27C020-200DCB vs AM27C020-200DI |
AM27C020-200DE | UVPROM, 256KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | AM27C020-200DCB vs AM27C020-200DE |
27C020-200V10 | UVPROM, 256KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | Intel Corporation | AM27C020-200DCB vs 27C020-200V10 |
AT27LV020-20DI | UVPROM, 256KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | AM27C020-200DCB vs AT27LV020-20DI |