Part Details for AM27512DEB by AMD
Overview of AM27512DEB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Part Details for AM27512DEB
AM27512DEB CAD Models
AM27512DEB Part Data Attributes
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AM27512DEB
AMD
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Datasheet
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AM27512DEB
AMD
UVPROM, 64KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | WDIP, | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
JESD-30 Code | R-GDIP-T28 | |
Length | 37.1475 mm | |
Memory Density | 524288 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 64KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | NMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM27512DEB
This table gives cross-reference parts and alternative options found for AM27512DEB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27512DEB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TMS27C512JL | 524 288-Bit Programmable Read-Only Memory 28-CDIP | Texas Instruments | AM27512DEB vs TMS27C512JL |
AM27C512-255DIB | UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27512DEB vs AM27C512-255DIB |
MBM27C512-25Z | UVPROM, 64KX8, 250ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | AM27512DEB vs MBM27C512-25Z |
AM27C512L-255DCB | UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27512DEB vs AM27C512L-255DCB |
27LV512-25/J | 64K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | AM27512DEB vs 27LV512-25/J |
HN27512G-25 | UVPROM, 64KX8, 250ns, CMOS, CDIP28, CERDIP-28 | Hitachi Ltd | AM27512DEB vs HN27512G-25 |
M27C512-25F6E | 64KX8 UVPROM, 250ns, CDIP28, ROHS COMPLIANT, CERAMIC, DIP-28 | STMicroelectronics | AM27512DEB vs M27C512-25F6E |
AM27C512-255DCB | UVPROM, 64KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Spansion | AM27512DEB vs AM27C512-255DCB |
M27512-25F6 | 64KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | STMicroelectronics | AM27512DEB vs M27512-25F6 |
27LV512-25I/J | 64K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | AM27512DEB vs 27LV512-25I/J |