| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
296-AM2631CODGHMZCZRQ1CT-ND
|
DigiKey | IC MCU 64BIT 256KB TCM 324NFBGA Min Qty: 1 Lead time: 18 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
1000 In Stock |
|
$9.4180 / $20.1000 | Buy Now | |
|
DISTI #
595-2631CODGHMZCZRQ1
|
Mouser Electronics | ARM Microcontrollers - MCU Automotive single-core Arm® Cortex®-R5F MCU up to 400 MHz with real-time control and security 324-NFBGA -40 to 150 RoHS: Compliant | 1000 |
|
$10.2800 / $19.1300 | Buy Now |
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
TEXAS INSTRUMENTS INC
|
|
Package Description
|
NFBGA-324
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
5A992.C
|
|
HTS Code
|
8542.31.00.01
|
|
Samacsys Manufacturer
|
Texas Instruments
|
|
Additional Feature
|
256KBYTES TCM MEMORY ALSO AVAILABLE
|
|
Clock Frequency-Max
|
400 MHz
|
|
JESD-30 Code
|
S-PBGA-B324
|
|
Length
|
15 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Terminals
|
324
|
|
Operating Temperature-Max
|
150 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LFBGA
|
|
Package Equivalence Code
|
BGA324,18X18,32
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Screening Level
|
AEC-Q100
|
|
Seated Height-Max
|
1.4 mm
|
|
Supply Voltage-Max
|
1.26 V
|
|
Supply Voltage-Min
|
1.14 V
|
|
Supply Voltage-Nom
|
1.2 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
15 mm
|
|
uPs/uCs/Peripheral ICs Type
|
SoC
|
