Part Details for ADC-HC12BMM by C&D Technologies Inc
Overview of ADC-HC12BMM by C&D Technologies Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for ADC-HC12BMM
ADC-HC12BMM CAD Models
ADC-HC12BMM Part Data Attributes:
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ADC-HC12BMM
C&D Technologies Inc
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Datasheet
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ADC-HC12BMM
C&D Technologies Inc
ADC, Successive Approximation, 12-Bit, 1 Func, Serial, Parallel, Word Access, CMOS, CDIP32, HERMETIC SEALED, CERAMIC PACKAGE-32
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | C&D TECHNOLOGIES INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 | |
Analog Input Voltage-Max | 25 V | |
Analog Input Voltage-Min | -25 V | |
Conversion Time-Max | 300 µs | |
Converter Type | ADC, SUCCESSIVE APPROXIMATION | |
JESD-30 Code | R-CDIP-P32 | |
Linearity Error-Max (EL) | 0.012% | |
Negative Supply Voltage-Nom | -12 V | |
Number of Bits | 12 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Output Bit Code | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | |
Output Format | SERIAL, PARALLEL, WORD | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Sample Rate | 0.0034 MHz | |
Seated Height-Max | 4.9 mm | |
Supply Voltage-Nom | 12 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 22.86 mm |
Alternate Parts for ADC-HC12BMM
This table gives cross-reference parts and alternative options found for ADC-HC12BMM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADC-HC12BMM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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ADC-HC12BMC | ADC, Successive Approximation, 12-Bit, 1 Func, Serial, Parallel, Word Access, CMOS, CDIP32, HERMETIC SEALED, CERAMIC PACKAGE-32 | Murata Power Solutions | ADC-HC12BMM vs ADC-HC12BMC |
ADC-HC12BMM-QL | ADC, Successive Approximation, 12-Bit, 1 Func, Serial, Parallel, Word Access, CMOS, CDIP32, HERMETIC SEALED, CERAMIC PACKAGE-32 | C&D Technologies Inc | ADC-HC12BMM vs ADC-HC12BMM-QL |
ADC-HC12BMC | ADC, Successive Approximation, 12-Bit, 1 Func, Serial, Parallel, Word Access, CMOS, CDIP32, HERMETIC SEALED, CERAMIC PACKAGE-32 | C&D Technologies Inc | ADC-HC12BMM vs ADC-HC12BMC |
ADC-HC12BMM-QL | ADC, Successive Approximation, 12-Bit, 1 Func, Serial, Parallel, Word Access, CMOS, CDIP32, HERMETIC SEALED, CERAMIC PACKAGE-32 | Murata Power Solutions | ADC-HC12BMM vs ADC-HC12BMM-QL |
ADC-HC12BMM | ADC, Successive Approximation, 12-Bit, 1 Func, Serial, Parallel, Word Access, CMOS, CDIP32, HERMETIC SEALED, CERAMIC PACKAGE-32 | DATEL Inc | ADC-HC12BMM vs ADC-HC12BMM |
ADC-HC12BMM | ADC, Successive Approximation, 12-Bit, 1 Func, Serial, Parallel, Word Access, CMOS, CDIP32, HERMETIC SEALED, CERAMIC PACKAGE-32 | Murata Power Solutions | ADC-HC12BMM vs ADC-HC12BMM |