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Logic / Clock Drivers / 9ZXL1550DKILFT
Datasheets
9ZXL1550DKILFT by:
Integrated Device Technology Inc
Integrated Device Technology Inc
Renesas Electronics Corporation
Not Found

VFQFPN-64, Reel

Part Details for 9ZXL1550DKILFT by Integrated Device Technology Inc

Results Overview of 9ZXL1550DKILFT by Integrated Device Technology Inc

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9ZXL1550DKILFT Information

9ZXL1550DKILFT by Integrated Device Technology Inc is a Clock Driver.
Clock Drivers are under the broader part category of Logic Components.

Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.

Price & Stock for 9ZXL1550DKILFT

Part # Distributor Description Stock Price Buy
Vyrian Logic ICs 1593
RFQ

Part Details for 9ZXL1550DKILFT

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9ZXL1550DKILFT Part Data Attributes

Parametric Data
9ZXL1550DKILFT Integrated Device Technology Inc
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9ZXL1550DKILFT Integrated Device Technology Inc VFQFPN-64, Reel
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code VFQFPN
Package Description VFQFPN-64
Pin Count 64
Manufacturer Package Code NLG64P2
Reach Compliance Code compliant
Date Of Intro 2018-02-26
Family 9ZXL
Input Conditioning DIFFERENTIAL MUX
JESD-30 Code S-XQCC-N64
JESD-609 Code e3
Length 9 mm
Logic IC Type PLL BASED CLOCK DRIVER
Moisture Sensitivity Level 3
Number of Functions 1
Number of Inverted Outputs
Number of Terminals 64
Number of True Outputs 30
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC64,.35SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 3.5 ns
Same Edge Skew-Max (tskwd) 0.05 ns
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish TIN
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 9 mm

Alternate Parts for 9ZXL1550DKILFT

This table gives cross-reference parts and alternative options found for 9ZXL1550DKILFT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 9ZXL1550DKILFT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
9ZXL1550DKILFT Renesas Electronics Corporation Check for Price 15-Output DB1900ZL PCIe Zero-Delay/Fanout Clock Buffer, VFQFPN0/Reel 9ZXL1550DKILFT vs 9ZXL1550DKILFT

9ZXL1550DKILFT Frequently Asked Questions (FAQ)

  • The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near the center of the board. Thermal management involves using a heat sink with a thermal interface material, and ensuring good airflow around the device.

  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage and current limits. Additionally, consider using thermal protection devices, such as thermistors or thermal switches, to prevent overheating.

  • Using a different clock source or frequency than recommended may affect the device's performance, power consumption, and jitter characteristics. It's essential to consult with the manufacturer or a qualified engineer to ensure the clock source and frequency meet the device's requirements.

  • To troubleshoot signal integrity and jitter issues, use high-speed signal analysis tools, such as oscilloscopes or signal analyzers, to measure signal quality and jitter. Also, review the PCB layout and design to ensure proper signal routing and termination.

  • To minimize EMI and RFI, use proper shielding, grounding, and decoupling techniques. Ensure that the device is placed in a shielded enclosure, and use EMI filters or absorbers as needed. Additionally, follow good PCB design practices, such as using a solid ground plane and minimizing signal loop areas.