Part Details for 93LC66AT-I/MSG by Microchip Technology Inc
Overview of 93LC66AT-I/MSG by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 93LC66AT-I/MSG
93LC66AT-I/MSG CAD Models
93LC66AT-I/MSG Part Data Attributes
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93LC66AT-I/MSG
Microchip Technology Inc
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Datasheet
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93LC66AT-I/MSG
Microchip Technology Inc
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Part Package Code | MSOP | |
Package Description | TSSOP, TSSOP8,.19 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 2 MHz | |
Data Retention Time-Min | 200 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | S-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 3 mm | |
Memory Density | 4096 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 512 words | |
Number of Words Code | 512 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512X8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.19 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.1 mm | |
Serial Bus Type | MICROWIRE | |
Standby Current-Max | 0.000001 A | |
Supply Current-Max | 0.002 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2.5 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Width | 3 mm | |
Write Cycle Time-Max (tWC) | 6 ms | |
Write Protection | SOFTWARE |
Alternate Parts for 93LC66AT-I/MSG
This table gives cross-reference parts and alternative options found for 93LC66AT-I/MSG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 93LC66AT-I/MSG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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93LC66A-E/MS | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 | Microchip Technology Inc | 93LC66AT-I/MSG vs 93LC66A-E/MS |
93LC66A-I/MS | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 | Microchip Technology Inc | 93LC66AT-I/MSG vs 93LC66A-I/MS |
93LC66A-E/MSG | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 | Microchip Technology Inc | 93LC66AT-I/MSG vs 93LC66A-E/MSG |
93LC66AT-E/MSG | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 | Microchip Technology Inc | 93LC66AT-I/MSG vs 93LC66AT-E/MSG |
BR93C66-WDS6TP | EEPROM, 512X8, Serial, CMOS, PDSO8, 3 X 3 MM, MO-187AA, TSSOP-8 | ROHM Semiconductor | 93LC66AT-I/MSG vs BR93C66-WDS6TP |
93LC66AT-I/MS | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 | Microchip Technology Inc | 93LC66AT-I/MSG vs 93LC66AT-I/MS |