Datasheets
93LC56C-I/S15K by: Microchip Technology Inc

2K, 256 X 8 OR 128 X 16, SER EE,, -40C to +85C, Die-Waffle, WPAC

Part Details for 93LC56C-I/S15K by Microchip Technology Inc

Results Overview of 93LC56C-I/S15K by Microchip Technology Inc

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93LC56C-I/S15K Information

93LC56C-I/S15K by Microchip Technology Inc is an EEPROM.
EEPROMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for 93LC56C-I/S15K

Part # Distributor Description Stock Price Buy
DISTI # 93LC56C-I/S15K
Microchip Technology Inc 2K, 256 X 8 OR 128 X 16, SER EE,, DICE, Projected EOL: 2034-05-21 ECCN: EAR99 RoHS: Compliant Lead time: 4 Weeks, 0 Days Container: Wafer Pack 0

Alternates Available
  • 1 $0.2900
  • 25 $0.2700
  • 100 $0.2600
  • 1,000 $0.2500
  • 5,000 $0.2400
$0.2400 / $0.2900 Buy Now
NAC 2k, 256 X 8 OR 128 X 16 SERIAL EE DIE in WAFFLE PK, Package: 0 DICE WPAC - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 0
RFQ

Part Details for 93LC56C-I/S15K

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93LC56C-I/S15K Part Data Attributes

93LC56C-I/S15K Microchip Technology Inc
Buy Now Datasheet
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93LC56C-I/S15K Microchip Technology Inc 2K, 256 X 8 OR 128 X 16, SER EE,, -40C to +85C, Die-Waffle, WPAC
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Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description DICE
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Factory Lead Time 4 Weeks
Additional Feature ALSO OPERATES WITH 1.8VMIN @1MHZ AND 2.5VMIN @2MHZ
Alternate Memory Width 8
Clock Frequency-Max (fCLK) 3 MHz
Data Retention Time-Min 200
Endurance 1000000 Write/Erase Cycles
JESD-30 Code R-XUUC-N
Memory Density 2048 bit
Memory IC Type EEPROM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Words 128 words
Number of Words Code 128
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128X16
Output Characteristics TOTEM POLE
Package Body Material UNSPECIFIED
Package Code DIE
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR
Package Style UNCASED CHIP
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Ready/Busy YES
Reverse Pinout NO
Screening Level TS 16949
Serial Bus Type MICROWIRE
Standby Current-Max 0.000001 A
Supply Current-Max 0.002 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Position UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit YES
Write Cycle Time-Max (tWC) 6 ms
Write Protection SOFTWARE