Part Details for 93LC56C-I/S15K by Microchip Technology Inc
Results Overview of 93LC56C-I/S15K by Microchip Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
93LC56C-I/S15K Information
93LC56C-I/S15K by Microchip Technology Inc is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for 93LC56C-I/S15K
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
93LC56C-I/S15K
|
Microchip Technology Inc | 2K, 256 X 8 OR 128 X 16, SER EE,, DICE, Projected EOL: 2034-05-21 ECCN: EAR99 RoHS: Compliant Lead time: 4 Weeks, 0 Days Container: Wafer Pack |
0 Alternates Available |
|
$0.2400 / $0.2900 | Buy Now |
|
NAC | 2k, 256 X 8 OR 128 X 16 SERIAL EE DIE in WAFFLE PK, Package: 0 DICE WPAC - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
|
RFQ |
Part Details for 93LC56C-I/S15K
93LC56C-I/S15K CAD Models
93LC56C-I/S15K Part Data Attributes
|
93LC56C-I/S15K
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
93LC56C-I/S15K
Microchip Technology Inc
2K, 256 X 8 OR 128 X 16, SER EE,, -40C to +85C, Die-Waffle, WPAC
Select a part to compare: |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | DICE | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Factory Lead Time | 4 Weeks | |
Additional Feature | ALSO OPERATES WITH 1.8VMIN @1MHZ AND 2.5VMIN @2MHZ | |
Alternate Memory Width | 8 | |
Clock Frequency-Max (fCLK) | 3 MHz | |
Data Retention Time-Min | 200 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-XUUC-N | |
Memory Density | 2048 bit | |
Memory IC Type | EEPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words | 128 words | |
Number of Words Code | 128 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128X16 | |
Output Characteristics | TOTEM POLE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | RECTANGULAR | |
Package Style | UNCASED CHIP | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Ready/Busy | YES | |
Reverse Pinout | NO | |
Screening Level | TS 16949 | |
Serial Bus Type | MICROWIRE | |
Standby Current-Max | 0.000001 A | |
Supply Current-Max | 0.002 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Toggle Bit | YES | |
Write Cycle Time-Max (tWC) | 6 ms | |
Write Protection | SOFTWARE |