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Part Details for 8T33FS6111DXGI by Renesas Electronics Corporation
Overview of 8T33FS6111DXGI by Renesas Electronics Corporation
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Applications
Aerospace and Defense
Part Details for 8T33FS6111DXGI
8T33FS6111DXGI CAD Models
8T33FS6111DXGI Part Data Attributes:
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8T33FS6111DXGI
Renesas Electronics Corporation
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8T33FS6111DXGI
Renesas Electronics Corporation
Low Voltage 2.5V/3.3V Differential LVPECL/HSTL Fanout Buffer, PTQFP250/Tray
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| Pbfree Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | PTQFP | |
| Pin Count | 32 | |
| Manufacturer Package Code | DXG32 | |
| ECCN Code | NLR | |
| HTS Code | 8542390001 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Additional Feature | ALSO OPERATES AT 3.135 TO 3.465 V SUPPLY | |
| Family | 8T | |
| Input Conditioning | DIFFERENTIAL MUX | |
| JESD-30 Code | S-PQFP-G32 | |
| JESD-609 Code | e3 | |
| Length | 7 mm | |
| Logic IC Type | LOW SKEW CLOCK DRIVER | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Inverted Outputs | ||
| Number of Terminals | 32 | |
| Number of True Outputs | 20 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HTQFP | |
| Package Equivalence Code | TQFP32,.35SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, THIN PROFILE | |
| Packing Method | TRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Propagation Delay (tpd) | 0.53 ns | |
| Same Edge Skew-Max (tskwd) | 0.05 ns | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Width | 7 mm |