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Microcontrollers and Processors / Bus Controllers / 89HPES4T4ZBBCG
Datasheets
89HPES4T4ZBBCG by:
Integrated Device Technology Inc
Integrated Device Technology Inc
Renesas Electronics Corporation
Not Found

CABGA-144, Tray

Part Details for 89HPES4T4ZBBCG by Integrated Device Technology Inc

Results Overview of 89HPES4T4ZBBCG by Integrated Device Technology Inc

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Computing and Data Storage

89HPES4T4ZBBCG Information

89HPES4T4ZBBCG by Integrated Device Technology Inc is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for 89HPES4T4ZBBCG

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89HPES4T4ZBBCG Part Data Attributes

Parametric Data
89HPES4T4ZBBCG Integrated Device Technology Inc
Buy Now Datasheet
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89HPES4T4ZBBCG Integrated Device Technology Inc CABGA-144, Tray
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA
Package Description CABGA-144
Pin Count 144
Manufacturer Package Code BCG144
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Address Bus Width
Bus Compatibility PCI
Clock Frequency-Max 125 MHz
External Data Bus Width
JESD-30 Code S-PBGA-B144
JESD-609 Code e1
Length 13 mm
Moisture Sensitivity Level 3
Number of Terminals 144
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max 1.1 V
Supply Voltage-Min 0.9 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, PCI

Alternate Parts for 89HPES4T4ZBBCG

This table gives cross-reference parts and alternative options found for 89HPES4T4ZBBCG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 89HPES4T4ZBBCG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
89HPES4T4ZBBCI Integrated Device Technology Inc Check for Price CABGA-144, Tray 89HPES4T4ZBBCG vs 89HPES4T4ZBBCI
89HPES4T4ZBBCGI Integrated Device Technology Inc Check for Price CABGA-144, Tray 89HPES4T4ZBBCG vs 89HPES4T4ZBBCGI
89HPES4T4ZBBC Integrated Device Technology Inc Check for Price CABGA-144, Tray 89HPES4T4ZBBCG vs 89HPES4T4ZBBC
89HPES4T4ZBBCGI Renesas Electronics Corporation Check for Price 4-lane, 4-port PCIe I/O Expansion Switch, CABGA160/Tray 89HPES4T4ZBBCG vs 89HPES4T4ZBBCGI
89HPES4T4ZBBCG8 Integrated Device Technology Inc Check for Price CABGA-144, Reel 89HPES4T4ZBBCG vs 89HPES4T4ZBBCG8
89HPES4T4ZBBC8 Integrated Device Technology Inc Check for Price CABGA-144, Reel 89HPES4T4ZBBCG vs 89HPES4T4ZBBC8
89HPES4T4ZBNQG Integrated Device Technology Inc Check for Price VFQFPN-132, Tray 89HPES4T4ZBBCG vs 89HPES4T4ZBNQG
89HPES4T4ZBNQ Integrated Device Technology Inc Check for Price PCI Bus Controller, 10 X 10 MM, 0.65 MM PITCH, QFN-132 89HPES4T4ZBBCG vs 89HPES4T4ZBNQ
89HPES4T4ZBBCI8 Integrated Device Technology Inc Check for Price CABGA-144, Reel 89HPES4T4ZBBCG vs 89HPES4T4ZBBCI8

89HPES4T4ZBBCG Related Parts

89HPES4T4ZBBCG Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.

  • Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal vias to keep the device within the recommended operating temperature range. Ensure proper airflow and avoid thermal hotspots.

  • Omitting or incorrectly terminating the differential pairs can lead to signal reflections, increased jitter, and reduced signal integrity. Always use the recommended termination resistors to ensure signal quality and reliability.

  • While the 89HPES4T4ZBBCG is designed for PCIe applications, it can be used in other high-speed differential signaling applications with proper design and layout considerations. Consult with IDT support for guidance on non-PCIe usage.

  • Use signal integrity analysis tools such as IBIS models, signal generators, and oscilloscopes to identify and debug signal integrity issues. Consult the IDT application notes and support resources for guidance on troubleshooting signal integrity issues.