-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
3-lane, 3-port PCIe I/O Expansion Switch, CABGA160/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
89HPES3T3ZBBCG by Renesas Electronics Corporation is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
89HPES3T3ZBBCG
|
Avnet Silica | 3lane 3port PCIe IO Expansion Switch (Alt: 89HPES3T3ZBBCG) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 143 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
89HPES3T3ZBBCG
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
89HPES3T3ZBBCG
Renesas Electronics Corporation
3-lane, 3-port PCIe I/O Expansion Switch, CABGA160/Tray
Select a part to compare: |
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Pin Count | 144 | |
Manufacturer Package Code | BCG144 | |
Reach Compliance Code | compliant | |
ECCN Code | NLR | |
HTS Code | 8542390001 | |
Samacsys Manufacturer | Renesas Electronics | |
Address Bus Width | ||
Bus Compatibility | PCI | |
Clock Frequency-Max | 100 MHz | |
Data Transfer Rate-Max | 312.5 MBps | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B144 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 144 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA144,12X12,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Supply Voltage-Max | 1.1 V | |
Supply Voltage-Min | 0.9 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm | |
uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |