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Overview of 89HPES24T3G2ZFBLG by Integrated Device Technology Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for 89HPES24T3G2ZFBLG by Integrated Device Technology Inc
Part Data Attributes for 89HPES24T3G2ZFBLG by Integrated Device Technology Inc
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Rohs Code
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Yes
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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INTEGRATED DEVICE TECHNOLOGY INC
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Package Description
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BGA, BGA676,26X26,40
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Reach Compliance Code
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compliant
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ECCN Code
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3A991.A.2
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HTS Code
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8542.31.00.01
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Address Bus Width
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Bus Compatibility
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PCI; SMBUS
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Clock Frequency-Max
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125 MHz
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External Data Bus Width
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JESD-30 Code
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S-PBGA-B676
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Length
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27 mm
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Number of Terminals
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676
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Equivalence Code
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BGA676,26X26,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Qualification Status
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Not Qualified
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Seated Height-Max
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3.22 mm
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Supply Current-Max
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1600 mA
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Supply Voltage-Max
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1.1 V
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Supply Voltage-Min
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0.9 V
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Supply Voltage-Nom
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1 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Width
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27 mm
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uPs/uCs/Peripheral ICs Type
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BUS CONTROLLER, PCI
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