Part Details for 88P8341BHGI by Integrated Device Technology Inc
Overview of 88P8341BHGI by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for 88P8341BHGI
88P8341BHGI CAD Models
88P8341BHGI Part Data Attributes
|
|
88P8341BHGI
Integrated Device Technology Inc
Buy Now
Datasheet
|
Compare Parts:
88P8341BHGI
Integrated Device Technology Inc
Microprocessor Circuit, CMOS, PBGA820, 35 X 35 MM, GREEN, PLASTIC, BGA-820
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, GREEN, PLASTIC, BGA-820 | |
| Pin Count | 820 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO REQUIRES 3.3 V I/O SUPPLY | |
| JESD-30 Code | S-PBGA-B820 | |
| JESD-609 Code | e3 | |
| Length | 35 mm | |
| Number of Terminals | 820 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA820,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.96 V | |
| Supply Voltage-Min | 1.68 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |