Part Details for 88MW320-A0-NAPI/AK by NXP Semiconductors
Overview of 88MW320-A0-NAPI/AK by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for 88MW320-A0-NAPI/AK
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
51AH8531
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Newark | Low-Power Wlan Microcontroller System-On-Chip (Soc) /Tray Rohs Compliant: Yes |Nxp 88MW320-A0-NAPI/AK Min Qty: 1300 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$4.8400 | Buy Now |
|
DISTI #
568-88MW320-A0-NAPI/AK-ND
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DigiKey | IC RF TXRX+MCU BLE 68HVQFN Min Qty: 1300 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$5.1249 | Buy Now |
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DISTI #
88MW320-A0-NAPI/AK
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Avnet Americas | - Trays (Alt: 88MW320-A0-NAPI/AK) Min Qty: 1300 Package Multiple: 1300 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$4.3426 / $4.9833 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1300 Package Multiple: 1300 Lead time: 16 Weeks Container: Tray | 0Tray |
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$4.1900 | Buy Now |
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DISTI #
88MW320-A0-NAPI/AK
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Avnet Silica | (Alt: 88MW320-A0-NAPI/AK) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 18 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for 88MW320-A0-NAPI/AK
88MW320-A0-NAPI/AK CAD Models
88MW320-A0-NAPI/AK Part Data Attributes
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88MW320-A0-NAPI/AK
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
88MW320-A0-NAPI/AK
NXP Semiconductors
Microcontroller
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HVQCCN, LCC68,.32SQ,16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Date Of Intro | 2020-07-14 | |
| JESD-30 Code | S-XQCC-N68 | |
| Length | 8 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 68 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC68,.32SQ,16 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max | 1.21 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |