Part Details for 8403615LA by LOGIC Devices Inc
Overview of 8403615LA by LOGIC Devices Inc
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Medical Imaging
Robotics and Drones
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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8403615LA | Renesas Electronics Corporation | 5.0V 2K x 8 Asynchronous Static RAM |
Part Details for 8403615LA
8403615LA CAD Models
8403615LA Part Data Attributes
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8403615LA
LOGIC Devices Inc
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8403615LA
LOGIC Devices Inc
Standard SRAM, 2KX8, 120ns, CMOS, CDIP24, CERAMIC, DIP-24
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | LOGIC DEVICES INC | |
Part Package Code | DIP | |
Package Description | CERAMIC, DIP-24 | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 120 ns | |
JESD-30 Code | R-GDIP-T24 | |
Length | 32.004 mm | |
Memory Density | 16384 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 2KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Screening Level | MIL-STD-883 | |
Seated Height-Max | 5.08 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7.62 mm |