Part Details for 8202502YA by LSI Corporation
Overview of 8202502YA by LSI Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 8202502YA
8202502YA CAD Models
8202502YA Part Data Attributes
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8202502YA
LSI Corporation
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Datasheet
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8202502YA
LSI Corporation
UVPROM, 16KX8, 250ns, CMOS, CDIP28,
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 131072 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 16KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 8202502YA
This table gives cross-reference parts and alternative options found for 8202502YA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8202502YA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NMC27C128BQ25 | 16KX8 UVPROM, 250ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | 8202502YA vs NMC27C128BQ25 |
| AM27C128-255DE | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 8202502YA vs AM27C128-255DE |
| TMS27C128JE4 | 16KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | 8202502YA vs TMS27C128JE4 |
| 27C128-25E/J | 16K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | 8202502YA vs 27C128-25E/J |
| MBM27128-25Z | UVPROM, 16KX8, 250ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | 8202502YA vs MBM27128-25Z |
| AM27C128-255DI | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 8202502YA vs AM27C128-255DI |
| 5962-8766106XX | 16K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Microchip Technology Inc | 8202502YA vs 5962-8766106XX |
| QD27128-25 | UVPROM, 16KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | 8202502YA vs QD27128-25 |
| 8202502YX | UVPROM, 16KX8, 250ns, CMOS, CDIP28, | LSI Corporation | 8202502YA vs 8202502YX |
| AM27C128-250DC | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 8202502YA vs AM27C128-250DC |