Part Details for 8200902JA by NXP Semiconductors
Overview of 8200902JA by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for 8200902JA
8200902JA CAD Models
8200902JA Part Data Attributes
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8200902JA
NXP Semiconductors
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8200902JA
NXP Semiconductors
IC 8K X 8 OTPROM, 55 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-GDIP-T24 | |
| Memory Density | 1024 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8192 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256X4 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Supply Current-Max | 0.19 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 8200902JA
This table gives cross-reference parts and alternative options found for 8200902JA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8200902JA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27S49A/BLA | OTP ROM, 8KX8, 55ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | AMD | 8200902JA vs AM27S49A/BLA |
| CY7C261-55DI | OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 | Cypress Semiconductor | 8200902JA vs CY7C261-55DI |
| N82HS641NB | 8KX8 OTPROM, 55ns, PDIP24 | Philips Semiconductors | 8200902JA vs N82HS641NB |
| 93Z565ADMQB | OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | 8200902JA vs 93Z565ADMQB |
| 5962-9080301MLA | OTP ROM, 8KX8, 55ns, CMOS, CDIP24, | Teledyne e2v | 8200902JA vs 5962-9080301MLA |
| N82HS641F | OTP ROM, 8KX8, 55ns, Bipolar, CDIP24 | Signetics | 8200902JA vs N82HS641F |
| 5962-9080305MLX | OTP ROM, 8KX8, 55ns, CMOS, CDIP24 | Cypress Semiconductor | 8200902JA vs 5962-9080305MLX |
| 93Z564DC | OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | 8200902JA vs 93Z564DC |
| 27HC641-55/SP | 8K X 8 OTPROM, 55 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | Microchip Technology Inc | 8200902JA vs 27HC641-55/SP |
| N82HS641N | IC 8K X 8 OTPROM, 55 ns, PDIP24, Programmable ROM | NXP Semiconductors | 8200902JA vs N82HS641N |