Part Details for 8200902JA by NXP Semiconductors
Overview of 8200902JA by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for 8200902JA
8200902JA CAD Models
8200902JA Part Data Attributes
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8200902JA
NXP Semiconductors
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8200902JA
NXP Semiconductors
IC 8K X 8 OTPROM, 55 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-GDIP-T24 | |
| Memory Density | 1024 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8192 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256X4 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Supply Current-Max | 0.19 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 8200902JA
This table gives cross-reference parts and alternative options found for 8200902JA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8200902JA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 27HC641-55I/P | Microchip Technology Inc | Check for Price | 8K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24 | 8200902JA vs 27HC641-55I/P |
| CY7C264-55PI | Cypress Semiconductor | Check for Price | OTP ROM, 8KX8, 55ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | 8200902JA vs CY7C264-55PI |
| 5962-9080301MLA | Cypress Semiconductor | Check for Price | OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | 8200902JA vs 5962-9080301MLA |
| 27HC641L-55/P | Microchip Technology Inc | Check for Price | 8K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24 | 8200902JA vs 27HC641L-55/P |
| 5962-9080305MLA | Cypress Semiconductor | Check for Price | OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | 8200902JA vs 5962-9080305MLA |
| 93Z564ADMQB | Fairchild Semiconductor Corporation | Check for Price | OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 | 8200902JA vs 93Z564ADMQB |
| 5962-9080301MLA | Teledyne e2v | Check for Price | OTP ROM, 8KX8, 55ns, CMOS, CDIP24, | 8200902JA vs 5962-9080301MLA |
| 27HC641L-55I/SP | Microchip Technology Inc | Check for Price | 8K X 8 OTPROM, 55 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | 8200902JA vs 27HC641L-55I/SP |
| 8200902JA | AMD | Check for Price | OTP ROM, 8KX8, 55ns, Bipolar, CDIP24, 1.290 X 0.610 X 0.225 INCH, DIP-24 | 8200902JA vs 8200902JA |
| N82HS641NB | NXP Semiconductors | Check for Price | IC 8K X 8 OTPROM, 55 ns, PDIP24, Programmable ROM | 8200902JA vs N82HS641NB |