Datasheets
80HCPS1616CHMG by:

FCBGA-400, Tray

Part Details for 80HCPS1616CHMG by Integrated Device Technology Inc

Overview of 80HCPS1616CHMG by Integrated Device Technology Inc

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Part Details for 80HCPS1616CHMG

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80HCPS1616CHMG Part Data Attributes:

80HCPS1616CHMG Integrated Device Technology Inc
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80HCPS1616CHMG Integrated Device Technology Inc FCBGA-400, Tray
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code FCBGA
Package Description FCBGA-400
Pin Count 400
Manufacturer Package Code HMG400
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Date Of Intro 2016-04-04
JESD-30 Code S-PBGA-B400
JESD-609 Code e1
Length 21 mm
Moisture Sensitivity Level 4
Number of Terminals 400
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Seated Height-Max 3.34 mm
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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