Datasheets
79RC32H434300BCI by: Integrated Device Technology Inc

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA256, 17 X 17 MM, MO-192AAF1, CABGA-256

Part Details for 79RC32H434300BCI by Integrated Device Technology Inc

Overview of 79RC32H434300BCI by Integrated Device Technology Inc

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Part Details for 79RC32H434300BCI

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79RC32H434300BCI Part Data Attributes:

79RC32H434300BCI Integrated Device Technology Inc
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79RC32H434300BCI Integrated Device Technology Inc RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA256, 17 X 17 MM, MO-192AAF1, CABGA-256
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description LBGA, BGA256,16X16,40
Pin Count 256
Reach Compliance Code not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 125 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Length 17 mm
Low Power Mode NO
Moisture Sensitivity Level 3
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Speed 300 MHz
Supply Voltage-Max 1.3 V
Supply Voltage-Min 1.1 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for 79RC32H434300BCI

This table gives cross-reference parts and alternative options found for 79RC32H434300BCI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 79RC32H434300BCI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
79RC32H434-300BC CABGA-256, Tray Integrated Device Technology Inc 79RC32H434300BCI vs 79RC32H434-300BC
79RC32H434300BC RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA256, 17 X 17 MM, MO-192AAF1, CABGA-256 Integrated Device Technology Inc 79RC32H434300BCI vs 79RC32H434300BC
79RC32H434-300BCI CABGA-256, Tray Integrated Device Technology Inc 79RC32H434300BCI vs 79RC32H434-300BCI
Part Number Description Manufacturer Compare
MPC850DHZT66A RISC Microprocessor, CMOS, PBGA256, PLASTIC, BGA-256 Motorola Semiconductor Products 79RC32H434300BCI vs MPC850DHZT66A
PPC604B120 RISC Microprocessor, 32-Bit, 120MHz, CMOS, CBGA256, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-256 Motorola Semiconductor Products 79RC32H434300BCI vs PPC604B120
DE-S1100-DB RISC Microprocessor, 32-Bit, 220MHz, CMOS, PBGA256, MINI, BGA-256 Intel Corporation 79RC32H434300BCI vs DE-S1100-DB
MPC875ZT66 32-BIT, 66MHz, RISC PROCESSOR, PBGA256 NXP Semiconductors 79RC32H434300BCI vs MPC875ZT66
L9A0212 RISC Microprocessor, 32-Bit, 85MHz, CMOS, PBGA256, PLASTIC, MO-151, BGA-256 Broadcom Limited 79RC32H434300BCI vs L9A0212
IBM25PPC750CXRKQ5024T RISC Microprocessor, 32-Bit, 500MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 IBM 79RC32H434300BCI vs IBM25PPC750CXRKQ5024T
MC9328MXLVM20 32-BIT, 200MHz, RISC PROCESSOR, PBGA256 NXP Semiconductors 79RC32H434300BCI vs MC9328MXLVM20
MPC875VR133 32-BIT, 133MHz, RISC PROCESSOR, PBGA256 NXP Semiconductors 79RC32H434300BCI vs MPC875VR133
79RC32T365150BCGI RISC Microprocessor, 32-Bit, 150MHz, CMOS, PBGA256 Integrated Device Technology Inc 79RC32H434300BCI vs 79RC32T365150BCGI
PC9328MX1VH 32-BIT, 150MHz, MICROPROCESSOR, PBGA256, 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, PLASTIC, MOLD ARRAY PROCESS, BGA-256 Motorola Mobility LLC 79RC32H434300BCI vs PC9328MX1VH

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