Part Details for 74LVT16245BBX,518 by NXP Semiconductors
Overview of 74LVT16245BBX,518 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 74LVT16245BBX,518
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74LVT16245BBX518-ND
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DigiKey | IC TXRX NON-INVERT 3.6V 60HXQFN Min Qty: 833 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
4475 In Stock |
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$0.3600 | Buy Now |
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Rochester Electronics | 74LVT16245BBX - Bus Transceiver, LVT Series, 2-Func, 8-Bit, True Output0, DHXQFN-60 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 4475 |
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$0.3094 / $0.3640 | Buy Now |
Part Details for 74LVT16245BBX,518
74LVT16245BBX,518 CAD Models
74LVT16245BBX,518 Part Data Attributes:
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74LVT16245BBX,518
NXP Semiconductors
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Datasheet
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Compare Parts:
74LVT16245BBX,518
NXP Semiconductors
74LVT16245B; 74LVTH16245B - 3.3 V 16-bit transceiver; 3-state
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT1134-1, HXQFN-60 | |
Pin Count | QFN | |
Manufacturer Package Code | SOT1134-2 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Control Type | COMMON CONTROL | |
Count Direction | BIDIRECTIONAL | |
Family | LVT | |
JESD-30 Code | R-PBCC-B60 | |
Length | 6 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | BUS TRANSCEIVER | |
Max I(ol) | 0.064 A | |
Moisture Sensitivity Level | 2 | |
Number of Bits | 8 | |
Number of Functions | 2 | |
Number of Ports | 2 | |
Number of Terminals | 60 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVBCC | |
Package Equivalence Code | LGA60,8X12,20 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 3.3 ns | |
Propagation Delay (tpd) | 3.5 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.5 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BUTT | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 4 mm |