Part Details for 74LVT16244BBX,518 by NXP Semiconductors
Overview of 74LVT16244BBX,518 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Telecommunications
Price & Stock for 74LVT16244BBX,518
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74LVT16244BBX518-ND
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DigiKey | IC BUFF NON-INVERT 3.6V 60HXQFN Min Qty: 833 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
4900 In Stock |
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$0.3600 | Buy Now |
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Rochester Electronics | 74LVT16244BBX - Bus Driver, LVT Series, 4-Func, 4-Bit, True Output0, HXQFN-60 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 4900 |
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$0.3094 / $0.3640 | Buy Now |
Part Details for 74LVT16244BBX,518
74LVT16244BBX,518 CAD Models
74LVT16244BBX,518 Part Data Attributes:
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74LVT16244BBX,518
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
74LVT16244BBX,518
NXP Semiconductors
74LVT16244B; 74LVTH16244B - 3.3 V 16-bit buffer/driver; 3-state
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT1134-1, HXQFN-60 | |
| Pin Count | QFN | |
| Manufacturer Package Code | SOT1134-2 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 4 Weeks | |
| Control Type | ENABLE LOW | |
| Family | LVT | |
| JESD-30 Code | R-PBCC-B60 | |
| Length | 6 mm | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | BUS DRIVER | |
| Max I(ol) | 0.064 A | |
| Moisture Sensitivity Level | 2 | |
| Number of Bits | 4 | |
| Number of Functions | 4 | |
| Number of Ports | 2 | |
| Number of Terminals | 60 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVBCC | |
| Package Equivalence Code | LGA60,8X12,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 3.2 ns | |
| Propagation Delay (tpd) | 4 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.5 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BUTT | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4 mm |