Part Details for 74LVCH8T245PW,118 by NXP Semiconductors
Overview of 74LVCH8T245PW,118 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for 74LVCH8T245PW,118
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Rochester Electronics | 74LVCH8T245 - 8-bit dual supply translating transceiver, 3-state RoHS: Compliant Status: Active Min Qty: 1 | 290 |
|
$0.3256 / $0.3830 | Buy Now |
Part Details for 74LVCH8T245PW,118
74LVCH8T245PW,118 CAD Models
74LVCH8T245PW,118 Part Data Attributes
|
74LVCH8T245PW,118
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
74LVCH8T245PW,118
NXP Semiconductors
74LVC(H)8T245 - 8-bit dual supply translating transceiver; 3-state TSSOP2 24-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | TSSOP2 | |
Package Description | 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24 | |
Pin Count | 24 | |
Manufacturer Package Code | SOT355-1 | |
Reach Compliance Code | compliant | |
Control Type | COMMON CONTROL | |
Count Direction | BIDIRECTIONAL | |
Family | LVC/LCX/Z | |
JESD-30 Code | R-PDSO-G24 | |
Length | 7.8 mm | |
Load Capacitance (CL) | 15 pF | |
Logic IC Type | BUS TRANSCEIVER | |
Max I(ol) | 0.024 A | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 1 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP24,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 10.3 ns | |
Propagation Delay (tpd) | 32 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.2 V | |
Supply Voltage-Nom (Vsup) | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 4.4 mm |