Part Details for 74LVC3GU04GF,115 by NXP Semiconductors
Overview of 74LVC3GU04GF,115 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Audio and Video Systems
Smart Cities
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Price & Stock for 74LVC3GU04GF,115
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74LVC3GU04GF,115-ND
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DigiKey | IC INVERTER 3CH 3-INP 8XSON Min Qty: 1629 Container: Bulk MARKETPLACE PRODUCT |
8554 In Stock |
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$0.1800 | Buy Now |
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Rochester Electronics | 74LVC3GU04GF - Inverter, LVC/LCX/Z Series, 3-Func, 1-Input, XSON-8 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 8554 |
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$0.1580 / $0.1859 | Buy Now |
Part Details for 74LVC3GU04GF,115
74LVC3GU04GF,115 CAD Models
74LVC3GU04GF,115 Part Data Attributes:
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74LVC3GU04GF,115
NXP Semiconductors
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Datasheet
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Compare Parts:
74LVC3GU04GF,115
NXP Semiconductors
74LVC3GU04 - Triple inverter SON 8-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SON | |
Package Description | 1.35 X 1 MM, 0.5 MM HEIGHT, MO-252, SOT1089, SON-8 | |
Pin Count | 8 | |
Manufacturer Package Code | SOT1089 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Family | LVC/LCX/Z | |
JESD-30 Code | R-PDSO-N8 | |
JESD-609 Code | e3 | |
Length | 1.35 mm | |
Logic IC Type | INVERTER | |
Max I(ol) | 0.024 A | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 3 | |
Number of Inputs | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VSON | |
Package Equivalence Code | SOLCC8,.04,14 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Propagation Delay (tpd) | 6.3 ns | |
Qualification Status | Not Qualified | |
Schmitt Trigger | NO | |
Seated Height-Max | 0.5 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.35 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 1 mm |