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74LVC2G34-Q100 - Dual buffer gate TSOP 6-Pin
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
74LVC2G34GV-Q100,1
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Avnet Americas | Buffer 2-CH Non-Inverting CMOS 6-Pin TSOP T/R - Tape and Reel (Alt: 74LVC2G34GV-Q100,1) RoHS: Not Compliant Min Qty: 12000 Package Multiple: 3000 Lead time: 6 Weeks, 0 Days Container: Reel | 0 |
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$0.0593 / $0.0707 | Buy Now |
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74LVC2G34GV-Q100,1
NXP Semiconductors
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Datasheet
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74LVC2G34GV-Q100,1
NXP Semiconductors
74LVC2G34-Q100 - Dual buffer gate TSOP 6-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | TSOP | |
Package Description | PLASTIC, SC-74, SOT-457, TSOP-6 | |
Pin Count | 6 | |
Manufacturer Package Code | SOT457 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | NXP | |
Family | LVC/LCX/Z | |
JESD-30 Code | R-PDSO-G6 | |
JESD-609 Code | e3 | |
Length | 2.9 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | BUFFER | |
Max I(ol) | 0.024 A | |
Number of Functions | 2 | |
Number of Inputs | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSOP6,.11,37 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TR | |
Prop. Delay@Nom-Sup | 5.1 ns | |
Propagation Delay (tpd) | 10.8 ns | |
Qualification Status | Not Qualified | |
Schmitt Trigger | NO | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.95 mm | |
Terminal Position | DUAL | |
Width | 1.5 mm |