Part Details for 74LVC16373ADGG,118 by NXP Semiconductors
Overview of 74LVC16373ADGG,118 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Telecommunications
Price & Stock for 74LVC16373ADGG,118
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74LVC16373ADGG,118-954-ND
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DigiKey | NEXPERIA 74LVC16373ADGG - BUS DR Min Qty: 1249 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
1249 In Stock |
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$0.3200 | Buy Now |
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Rochester Electronics | 74LVC16373ADGG - Bus Driver, LVC/LCX/Z Series, 2-Func, 8-Bit, True Output, CMOS, TSSOP48 RoHS: Compliant Status: Active Min Qty: 1 | 1249 |
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$0.2643 / $0.3110 | Buy Now |
Part Details for 74LVC16373ADGG,118
74LVC16373ADGG,118 CAD Models
74LVC16373ADGG,118 Part Data Attributes
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74LVC16373ADGG,118
NXP Semiconductors
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Datasheet
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74LVC16373ADGG,118
NXP Semiconductors
74LVC(H)16373A - 16-bit D-type transparent latch with 5 V tolerant inputs/outputs; 3-state TSSOP 48-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | TSSOP | |
| Package Description | 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48 | |
| Pin Count | 48 | |
| Manufacturer Package Code | SOT362-1 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 4 Weeks | |
| Family | LVC/LCX/Z | |
| JESD-30 Code | R-PDSO-G48 | |
| JESD-609 Code | e4 | |
| Length | 12.5 mm | |
| Logic IC Type | BUS DRIVER | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 2 | |
| Number of Ports | 2 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP48,.3,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Propagation Delay (tpd) | 7 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.2 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6.1 mm |