Part Details for 74LVC157APW by Philips Semiconductors
Overview of 74LVC157APW by Philips Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Telecommunications
Communication and Networking
Price & Stock for 74LVC157APW
Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 2500 |
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RFQ |
Part Details for 74LVC157APW
74LVC157APW CAD Models
74LVC157APW Part Data Attributes
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74LVC157APW
Philips Semiconductors
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Datasheet
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74LVC157APW
Philips Semiconductors
Multiplexer, 4-Func, 2 Line Input, CMOS, PDSO16
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-PDSO-G16 | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | MULTIPLEXER | |
Max I(ol) | 0.024 A | |
Number of Functions | 4 | |
Number of Inputs | 2 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP16,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TUBE | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 6.5 ns | |
Qualification Status | Not Qualified | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.635 mm | |
Terminal Position | DUAL |